POLYTRONIC 2004 will be the 4th in the Conference series, begun in 2001 as an
amalgamation of the previously successful series of IEEE Conferences on adhesives and polymers:
Polymeric Materials for Microelectronic & Photonic Applications (POLY)
Adhesives in Electronics
Polymeric Electronics Packaging (PEP)
The conference provides a unique opportunity for the
meeting of polymer developers to meet with polymer users from the
electronics and photonics industries. Research paper presentations will cover all aspects of
adhesives and polymers in microelectronics and photonics, including
development of new polymers, organic devices, polymers in packaging,
adhesive applications, etc.
A new feature of the conference will be the availability
of all paper presentations on-line (as videos), for a fee. |
Conference Venue
Close to downtown Portland at the
Lloyd Center DoubleTree Hotel in scenic Oregon.
Dates
15 July 2004
Submission of abstracts
20 July 2004
Notification of acceptance
15 August 2004
Final papers due
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