Polytronic 2004: 4th International IEEE Conference
on Polymers and Adhesives in Microelectronics and Photonics

Portland, Oregon, USA
12-15 September 2004
POLYTRONIC 2004 will be the 4th in the Conference series, begun in 2001 as an amalgamation of the previously successful series of IEEE Conferences on adhesives and polymers:
Polymeric Materials for Microelectronic & Photonic Applications (POLY)
Adhesives in Electronics
Polymeric Electronics Packaging (PEP)

The conference provides a unique opportunity for the meeting of polymer developers to meet with polymer users from the electronics and photonics industries. Research paper presentations will cover all aspects of adhesives and polymers in microelectronics and photonics, including development of new polymers, organic devices, polymers in packaging, adhesive applications, etc.

A new feature of the conference will be the availability of all paper presentations on-line (as videos), for a fee.

Conference Venue
Close to downtown Portland at the Lloyd Center DoubleTree Hotel in scenic Oregon.

Dates
15 July 2004
      Submission of abstracts
20 July 2004
      Notification of acceptance
15 August 2004
      Final papers due


Polytronic 2004 Conference, Portland OR   *   Call for Papers   *   About Us   *   Contact Us